Abstract Guidelines

TRANS-IPIC is currently accepting abstract submissions the 2026 International Symposium on Shape Memory Alloys in Infrastructure.

Please see the guidance below for abstract submissions.

Open Call for Abstract Submissions and Due Date:

- Researchers, engineers, and industry professionals are invited to submit innovative concepts, case studies, or experimental findings that explore SMA's potential in enhancing resilience, adaptability, and longevity of civil infrastructure.
- Abstract submissions are due on January 30, 2026.

Areas of Interest

Topics of interest for submission include, but are not limited to:

1) Material Behavior & Characterization
- Thermo-mechanical properties, fatigue, and constitutive modeling of SMAs.
2) Seismic Applications
- SMA-based dampers, braces, and self-centering connections for earthquake resilience.
3) Prestressing & Strengthening
- SMA bars, tendons, and wires for prestressing, retrofitting, and crack control in concrete structures.
4) Structural Applications
- Use of SMA in bridges and other types of structures.
5) Infrastructure Applications
- SMA for pipelines, pavements, foundations, transportation networks, and resilient lifeline systems.
6) Smart & Adaptive Systems
- Integration of SMA in hybrid designs, adaptive structures, and smart infrastructure.
7) Durability & Lifecycle Performance
- Durability, corrosion resistance, and long-term reliability.
8) Numerical Modeling & Simulation
- Finite element modeling, design methods, and predictive analysis of SMA-based systems.
9) Implementation & Industry Adoption
- Case studies, challenges in field application, cost considerations, and progress toward design codes.

Abstract Length:

Abstract Format

Abstract Submissions:

Questions about Symposium Abstracts may be sent to TRANS-IPIC@illinois.edu.