1st International Symposium on Shape Memory Alloys in Infrastructure
The Transportation Infrastructure Precast Innovation Center (TRANS-IPIC) is proud to host the 1st International Symposium on Shape Memory Alloys in Infrastructure.
TRANS-IPIC is a Tier 1 University Transportation Center (UTC) funded by the United States Department of Transportation, working to develop solutions for the transportation infrastructure challenges by innovating precast concrete related technologies that are durable, resilient, safe, and economic.
September 17th & 18th, 2026
Chicago, Illinois
Symposium Program
Symposium Scope
The 1st International Symposium on Shape Memory Alloys in Infrastructure will provide a forum to discuss the state-of-the-art research, emerging applications, and future directions of SMAs in structural, infrastructure, and transportation systems. The event aims to connect researchers, engineers, and industry professionals to exchange knowledge on how SMA’s unique thermomechanical properties, including superelasticity and shape memory effect, can be utilized to improve the safety, resilience, durability, and adaptability of civil infrastructure.
Areas of Interest
Topics of interest for submission include, but are not limited to:
- 1) Material Behavior & Characterization
- Thermo-mechanical properties, fatigue, and constitutive modeling of SMAs.
- 2) Seismic Applications
- SMA-based dampers, braces, and self-centering connections for earthquake resilience.
- 3) Prestressing & Strengthening
- SMA bars, tendons, and wires for prestressing, retrofitting, and crack control in concrete structures.
- 4) Structural Applications
- Use of SMA in bridges and other types of structures.
- 5) Infrastructure Applications
- SMA for pipelines, pavements, foundations, transportation networks, and resilient lifeline systems.
- 6) Smart & Adaptive Systems
- Integration of SMA in hybrid designs, adaptive structures, and smart infrastructure.
- 7) Durability & Lifecycle Performance
- Durability, corrosion resistance, and long-term reliability.
- 8) Numerical Modeling & Simulation
- Finite element modeling, design methods, and predictive analysis of SMA-based systems.
- 9) Implementation & Industry Adoption
- Case studies, challenges in field application, cost considerations, and progress toward design codes.
Proceedings:
Manuscripts will be presented at the 1st International Symposium on Shape Memory Alloys in Infrastructure. Following the event, each manuscript will be give an individual DOI and the entire symposium Proceedings will be published on Zenodo.
Registration & Fees
Full registration: US$600
Student registration: US$300
Accompanying person: US$150
*All accepted manuscripts must accompany a full registration to be published and presented at the symposium. One full registration covers a maximum of two manuscripts.
Symposium Chair
- Bassem Andrawes, University of Illinois Urbana-Champaign (United States)
Organizing Committee
- Shahria Alam, University of British Columbia, Okanagan Campus (Canada)
- Elyas Ghafoori, Leibniz University Hannover (Germany)
- Pan Shengshan, Dalian University of Technology (China)
Scientific Committee
- Muntasir Billah, University of Calgary (Canada)
- Hajin Choi, Soongsil University (South Korea)
- Jun Deng, Guangzhou University (China)
- Raafat El-Hacha, University of Calgary (Canada)
- Lucia Faravelli, University of Pavia (Italy)
- Hossein Heydarinouri, Empa (Switzerland)
- Mahmoud Higazey, Dar Al Uloom University (Saudi Arabia)
- Xu Jiang, Tongji University (China)
- Amir H. Iranmanesh, University of Illinois Chicago (United States)
- K. Eugene Kim, University of Waterloo (Canada)
- Mustafa Mahamid, University of Chicago (United States)
- Junhui Li, Foshan University (China)
- Osman E. Ozbulut, University of Virginia (United States)
- Dan Palermo, York University (Canada)
- Hui Qian, Zhengzhou University (China)
- Hayder Rasheed, Kansas State University (United States)
- Halil Sezen, The Ohio State University (United States)
- Moochul Shin, Western New England University (United States)
- Minsoo Sung, Ohio University (United States)
- Mostafa Tazarv, University of Nevada (United States)
- Wenwei Wang , Southeast University (China)
- Yanjie Xue, Jilin University (China)
- Maged A. Youssef, The University of Western Ontario (Canada)
- Wael Zatar, Marshall University (United States)
- Botong Zheng, The Pennsylvania State University (United States)
- Hong Zhu, Southeast University (China)
Venue Information:
This two-day event will be held at the Big Ten Office and Conference Center in Rosemont, IL.
5440 Park Place, Rosemont, IL 60018
Information on the Big Ten Office and Conference Center can be found HERE.
Travel Information:
The Big Ten Office and Conference Center is conveniently located less than 10 minutes from Chicago's O'Hare Airport.
Directions from O'Hare Airport to the B1G conference center can be found HERE.
Hotel Information:
Below are the hotels recommended by the Big Ten Office and Conference Center:
Parking Information:
Parking is conveniently located at the nearby Parkway Bank Park garage.
The validated rate is $7.50 per day. Please remember, tickets must be validated at the Big Ten security desk prior to returning to car for departure.