International Symposium on Shape Memory Alloys in Infrastructure

The Transportation Infrastructure Precast Innovation Center (TRANS-IPIC) is proud to host the 2026 International Symposium on Shape Memory Alloys in Infrastructure.

TRANS-IPIC is a Tier 1 University Transportation Center (UTC) funded by the United States Department of Transportation, working to develop solutions for the transportation infrastructure challenges by innovating precast concrete related technologies that are durable, resilient, safe, and economic.

Important Dates

  Accepting Abstract Submissions --- Open!  
  Abstract Submission Deadline --- January 30, 2026  
  Notification of Abstract Acceptance  --- Feb 6, 2026  
  Manuscript Submission Deadline --- March 27, 2026  
  Manuscript Revisions Due --- May 8, 2026  
  Notification of Manuscript Acceptance --- May 15, 2026  
  Early Registration Pricing Ends --- May 29, 2026  
  Event Registration Closes --- July 24, 2026  
  2-day Symposium --- September 17-18, 2026  
         
  Abstract Template HERE  
  Submit Abstract HERE  

 

Areas of Interest

Topics of interest for submission include, but are not limited to:

  • 1) Material Behavior & Characterization
    • Thermo-mechanical properties, fatigue, and constitutive modeling of SMAs.
  • 2) Seismic Applications
    • SMA-based dampers, braces, and self-centering connections for earthquake resilience.
  • 3) Prestressing & Strengthening
    • SMA bars, tendons, and wires for prestressing, retrofitting, and crack control in concrete structures.
  • 4) Structural Applications
    • Use of SMA in bridges and other types of structures.
  • 5) Infrastructure Applications
    • SMA for pipelines, pavements, foundations, transportation networks, and resilient lifeline systems.
  • 6) Smart & Adaptive Systems
    • Integration of SMA in hybrid designs, adaptive structures, and smart infrastructure.
  • 7) Durability & Lifecycle Performance
    • Durability, corrosion resistance, and long-term reliability.
  • 8) Numerical Modeling & Simulation
    • Finite element modeling, design methods, and predictive analysis of SMA-based systems.
  • 9) Implementation & Industry Adoption
    • Case studies, challenges in field application, cost considerations, and progress toward design codes.

Registration & Fees

Full registration: US$750 on or before May 29, 2026; US$900 after May 29, 2026

Student registration: US$450 on or before May 29, 2026; US$600 after May 29, 2026

Accompanying person: US$300

*All accepted manuscripts must accompany a full registration to be published and presented at the symposium. One full registration covers a maximum of two manuscripts.

Event Registration Portal Coming Soon

Scientific Committee

  • Muntasir Billah, University of Calgary (Canada)
  • Hajin Choi, Soongsil University (South Korea)
  • Jun Deng, Guangzhou University (China)
  • Raafat El-Hacha, University of Calgary (Canada)
  • Lucia Faravelli, University of Pavia (Italy)
  • Hossein Heydarinouri, Empa (Switzerland)
  • Mahmoud Higazey, Dar Al Uloom University (Saudi Arabia)
  • K. Eugene Kim, University of Waterloo (Canada)
  • Mustafa Mahamid, University of Chicago (United States)
  • Junhui Li, Foshan University (China)
  • Osman E. Ozbulut, University of Virginia (United States)
  • Dan Palermo, York University (Canada)
  • Xuhong Qiang, Tongji University (China)
  • Hui Qian, Zhengzhou University (China)
  • Hayder Rasheed,  Kansas State University (United States)
  • Halil Sezen, The Ohio State University (United States)
  • Moochul Shin, Western New England University (United States)
  • Minsoo Sung, Ohio University (United States)
  • Mostafa Tazarv, University of Nevada (United States)
  • Wenwei Wang , Southeast University (China)
  • Yanjie Xue, Jilin University (China)
  • Maged A. Youssef, The University of Western Ontario (Canada)
  • Wael Zatar, Marshall University (United States)
  • Botong Zheng, University of Southern California (United States)
  • Hong Zhu, Southeast University (China)

Hotel Information:

Below are the hotels recommended by the Big Ten Office and Conference Center: